Shenzhen Liquid Cooling Technology Co., Ltd (Cooler Tech)

Data Center Liquid Cooling Solutions For Rack Severs, Coldplate For CPU/GPU

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Coldplate

Technical parameter:
1. Heat Power : 0~660W
2. CPU socket type: LGA2066/LGA2011
3. Coldplate assembly dimension: 80mm*80mm
4. Coldplate dimension: 90mm * 90mm * 25.8mm
5. Coldplate heat transfer area: 44mm*34.5mm
Coldplate

Technical parameter:
1. Heat Power : 0~800W
2. CPU socket type: AMD-SP3
3. Coldplate assembly dimension: 105mm*65.2mm/46mm
4. Coldplate dimension: 117.5mm * 82mm * 25mm
5. Coldplate heat transfer area: 79.5mm*36.5mm
Coldplate

Technical parameter:
1. Heat Power : 0~1000W
2. CPU socket type: LGA4677
3. Coldplate assembly dimension: 102.5mm*57.6mm
4. Coldplate dimension: 118mm * 78mm * 25.3mm
5. Coldplate heat transfer area: 72mm*50mm

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Company Address: A1905, Dongcheng Central Garden, Liuyue Community, Henggang Street, Longgang District, Shenzhen, Guangdong Province, China
Factory address: Room 703, Building 1, No. 11, Kangyang 1st Street, Huangjiang Town, Dongguan City, Guangdong Province, China

Tel +86 136 0257 0905 Thomas Zhang
+86 159 1988 8662 Miss Xia

E-mail thomas@coolertech.com.cn
xiaxia@coolertech.com.cn