Shenzhen Liquid Cooling Technology Co., Ltd (Cooler Tech)
Data Center Liquid Cooling Solutions For Rack Severs, Coldplate For CPU/GPU
Develop various liquid cooled Coldplate modules for different CPUs and GPUs. As a component, independently verify reliability, sealing, heat dissipation efficiency, and more.
With the team's years of experience in liquid cooling and a deep understanding of liquid cooling technology, the Coldplate design of liquid cooling technology optimizes design parameters as much as possible, making the heat dissipation efficiency of each Coldplate very high.
Each Coldplate, combined with our cold exhaust and hydraulic pump, can dissipate 600-800 watts of heat, making it the primary choice for overclocking heat dissipation.
Excellent flow: The unique internal design of the quick connect ensures maximum flow and minimum flow resistance.
Drip free design: To avoid fluid leakage when the circuit is disconnected and cause pollution to the working environment.
Under pressure insertion and extraction: The sealing ring is designed with good positioning, so that the quick connector under pressure insertion and extraction will not leak.
Sealing Scheme: Provides a selection of different sealing ring materials, and various series of products are compatible with most fluids and cover a wide range of operating temperatures.
Product applications: server data centers, liquid cooled heat sinks for
high-end gaming consoles, CPU/GPU overall liquid cooled heat dissipation solutions.
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